Flux Pens
Flux Pens
In electronics manufacturing, certain soldering tasks require only the smallest amounts of flux to be applied for reliable soldering. Our flux pens offer a user-friendly method of applying flux to hard-to-reach areas. They are ideal for rework, repair and subsequent assembly of SMD components on densely mounted PCBs. The flux pens are precise, easy to handle and cost-efficient.
Flux Gels
Flux gels for rework and repair are usually developed as No-Clean products. In principle, they have the same chemical properties as the fluxes in solder pastes. We offer a wide variety of flux gels for different applications.
Flux-Gel HX21
Flux-Gel HX21 is a well activated flux gel for soft soldering of metals that cannot be soldered with common No-Clean fluxes. The field of application is electronics manufacturing as well as re-soldering or repair work. Suitable soldering methods are piston and bar soldering, as well as hot air (nitrogen) and reflow soldering.
Flux-Gel Kolopaste No. 8
Kolopaste No. 8 is suitable for repair soldering in SMT as well as for piston and bar soldering. It can also be used for large-area soldering of copper, brass and pre-tinned components. The extremely low halogen-free activation results in very good insulation behaviour of the flux residues after soldering.
Flux-Gel RMA04
Flux-Gel RMA04 is a ready-to-use, thickened rosin flux with a high solid content in paste form for soldering on copper, brass and tin-plated surfaces. The flux has a very high adhesive strength and can also hold larger components during reflow soldering. Therefore it is ideal for repair soldering of SMD components.
Flux-Gel Multifix 450-01
Flux-Gel Multifix 450-01 has been specially developed for rework and repair in the electronics industry. The flux gel is suitable for manual application as well as for automatic application by means of a dispenser.
Cleaning Pens
Flux-Ex 500
In electronics production, flux residues must be removed efficiently. Where cleaning of entire PCBs is not desired, the Flux-Ex 500 cleaning pen can be used. This cleaning pen offers a user-friendly method for removing flux residues in hard-to-reach places. It is ideal for use after rework, repairs and subsequent assembly of SMD components. These disposable pens are precise, easy to use and cost effective.
Desoldering Wicks
Solder-Ex Desoldering Wick
The Solder-Ex desoldering wick has been developed for the repair of solder joints. It consists of a copper braid and is coated with a special halogen-free flux that accelerates solder absorption. The Solder-Ex desoldering wick is available in four widths for different applications.
No-Clean Desoldering Wick
The No-Clean desoldering wick has been developed for the safe desoldering and repair of solder joints without the need for subsequent cleaning. The No-Clean desoldering wick is coated with a special halogen-free No-Clean flux that accelerates the speed at which solder is absorbed. Storage in a humid environment does not affect this characteristic. The solder strand remains flexible and does not oxidise.
Screen and Stencil Cleaner
Stencil Cleaning Wipes “Citrus”
Stencil cleaning wipes “citrus” are saturated with a specific solvent which ensures a good cleaning effect for a quick efficient removal of all sorts of solder paste and other flux contaminations. The stencil cleaning wipes are particularly suitable for stencils, printed circuit boards and assemblies. The lint-free wipes are delivered with a practical dispenser box and have a light citrus scent.
Solder Tip Cleaner
Tippy Solder Tip Cleaner
Tippy solder tip cleaner (lead-free) quickly cleans and tins slightly contaminated and oxidised soldering tips in one step. It consists of high-quality solder powder with activating additives. To clean, simply brush the soldering tip over the surface of the Tippy. The soldering tip temperature should be at least 220 °C and at most 450 °C. Cleaning and tinning improves the closer the tip temperature is to 450 °C.
All images on this page are sample images and may not correspond to the actual product.