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Tin Solder Ecoloy TSC305

Ecoloy TSC305 (Sn96,5Ag3Cu0,5) is a lead-free solder according to ISO 9453 (alloy number 711) which can replace eutectic or almost eutectic tin/lead or tin/lead/silver alloys.

The Ecoloy TSC305 alloy is manufactured from pure metals and has been developed to eliminate the use of tin/lead alloys in all existing production processes in electronics manufacturing and guarantees a lead-free soldering process.

Tin Solder Ecoloy TSC305

Product Advantages

  • good wetting characteristics
  • melting range of 217 to 222°C
  • longer service life due to reduced copper content
  • more economical than eutectic SnAgCu alloy due to 0.8 % lower silver content

Application

The use of Ecoloy TSC305 as wave solder requires a solder bath temperature of approx. 260 to 265°C. The use of inert gas means a significant extension of the process window. The wetting of the solder is improved and no excess solder remains on the components when exiting the wave. Ecoloy TSC305 can also be used in selective soldering systems.

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