Product Advantages

• finer grain structure and shinier surface than conventional Sn99.3Cu0.7 alloys
• eutectic alloy (defined melting point at 227°C)
• reduction of dross formation
• very good wetting characteristics
• highly reduced dissolution rate of copper and other metals in comparison with conventional Sn99Cu1 alloys and as a result significantly increased service lives of the solder baths
• reduction of defect rate due to much lower tendency to form bridges
• optimum working temperatures from 260-270°C
• SN100Ce is the copper-free version of the micro-allying solder. This re-fill solder can be used if the copper content in used solder baths is too high and needs to be reduced to the accepted level of 0.5 to 0.9%.

Application

The use of SN100C™ as wave solder requires a solder bath temperature of approx. 260 to 270 °C. The use of inert gas means a significant extension of the process window. The wetting of the solder is improved and no excess solder remains on the components when exiting the wave. Bridge formation is considerably reduced compared to standard solders. Furthermore, dross formation is considerably minimised. SN100C™ can also be used at elevated temperatures, e.g. in selective soldering systems.