Solder Paste SP2300D

For automatic dispensing processes, we offer the SP2300D solder paste. This has been developed for use with the alloy TSC305 (Sn96.5Ag3Cu0.5) as the standard alloy. SP2300D contains a highly active type L No-Clean flux. With a special formula for excellent wetting, the solder paste meets the requirements of high volume production. The wetting properties have been optimised for all known lead-free PCB and component coatings. The small amounts of residue after reflow are electrically safe and do not need to be removed.